It’s a concept that’s been cooked up for a while by Swedish company Frore Systems, a solution it calls “AirJet.” Think of this solid-state cooling solution with two membranes like the fins on a whale that connect to the PCB (printed circuit board) using an array of heat pipes. These fins fluctuate at a minimal level, essentially running at near-silent while pushing warm air out of the system.

The comment appeared during a discussion on AnandTech forums (yes, they are still around) about expected frequencies for RDNA 5 integrated graphics. Another forum member argued that the upcoming APU GPUs were unlikely to reach 4 GHz. Kepler_L2 then replied that AMD is targeting 3.1 to 3.4 GHz with RDNA 5. What’s unclear is whether this range applies to all RDNA 5 products or only selected dies and if you have been following our coverage, RDNA5 will span across several products, including discrete GPUs, integrated GPUs, and custom console chips.

Kepler_L2 has previously shared details about RDNA 5 implementation, including changes to its WGP design and future products. The architecture is expected to cover several GPU configurations rather than one common clock target, so final frequencies may depend on the die, power limits and product type.

Motherboard manufacturers already adjusted pricing in China during August, but the increases were relatively limited. According to the report, MSI increased prices across its lineup, while ASUS and Gigabyte focused on selected higher-volume models. Colorful and Maxsun also made smaller adjustments.

Motherboard manufacturers warn that costs may continue to rise.

The prices of upstream raw materials used in motherboard products have indeed increased considerably.

• PCB material prices have increased by 15% to 50% overall.
• Prices of various types of capacitors have generally increased by around 50%.
• Wi-Fi module prices have increased across the board, with increases ranging from 10% to 20%.

Earlier reports had already indicated that ASUS, Gigabyte and MSI were preparing pricing adjustments during the third quarter. Nova Lake-S launch under higher pressure given the transition to the new LGA-1954 socket by Intel.  

Also shows Q4+ 2027 will have LGA 1954 supporting Razor Lake and then Hammer Lake on the socket.